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Several common problems of reflow soldering method

Time:2014-06-26Source:This siteViews:837

Use now reflow soldering in electronic industry into a process indispensable, especially lead-free reflow soldering, welding in the modern environmental protection, has more important effect, the following interpretation handling for reflow common questions, I hope everyone can give some reference, and ask the fellow friends to make up and correct.
Flux coking is particularly common problem reflux welding technology, usually causes are over temperature caused. The method can be used to add the belt speed, may reduce the preset temperature.

The reasons for tin bridge has 3: positioning is not appropriate or halftone negative tin; tin paste slump; the heating speed is too fast. Treatment methods: check the positioning or clean the stencil, adjust the printing pressure; adding metal composition, viscosity temperature time curve to the suitable adjustment.

Tin removal or collapse because of reflow soldering wet timeout or high temperature environment of the form, of course, may also be the cause of solder paste viscosity small. Processing method: conditioning curve or adding speed may control the humidity of the environment; selection of solder paste suitable.

Element erected representation in the lead-free reflow in contrast to common, mostly because the heating speed is too fast or uneven ion, if the components of the poor weldability, solder paste composition unstable easily also presents the disadvantages. Processing method is: adjust the temperature time curve, carefully check the components, select high-quality suppliers, choose good solderability of solder paste.
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